芯片封装工程师招聘地点：南京学历：硕士工作经验：5-10年

　职位描述：

　与多个团队合作，根据SI/PI和ASIC设计团队的需求，开发IC封装设计。与OSAT密切合作，以确保根据不同的产品规格，生产产品。负责IC封装开发，系统堆叠整合与FCBGA封装设计

　主要资质：

　1、5+ relevant experience packaging and/or system integration.

　2、Excellent familiarity with Cadence SiP and other package designtools

　3、Good understanding of cross-functional packaging areas: systemstack integration, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system levelreliability, testing, and FA

　4、Good understanding of advanced packaging technologies: Knowledge and insight to deliver high density / high performanceinterconnects in various form factor, thermo-mechanical, reliability, andcost constraints

　5、AutoCAD and other mechanical design tools, thermal, designrules, BOM, design for manufacturing, reliability, and cost

　6、Basic knowledge of signal integrity / power integrity

　7、Education & Experience

　8、MSEE preferred and relevant experience within technicaldiscipline