技能要求:
传感器,电路设计,智能硬件,PCB工艺
职位描述:
将与多个团队合作,开发PCB封装,模具电源和信号完整性的方法、设计及模型。是ASIC设计后端和PCB设计团队之间的桥梁。
1、研究SI和PI建模、仿真和特征化内存接口
2、与电路和控制器团队合作优化内存系统设计
3、制定和执行测试计划,以验证信号和电源完整性
4、支持芯片内/封装上/板级的电源设计交付
5、对于硅片、封装和系统设计组提供实施指南和反馈
6、进行可行性研究、设计验证并交付签字
7、与产品工程和系统工程合作,调试和提高产品产量
主要资历:
•5+ years hands-on experience in design and analysis of productpower supply solution
•Experience in PI/SI methodology development, PDN modeling fromsystem to die, and familiarity with lab correlation/validation
•Strong familiarity with LPDDR4, LPDDR4x, and LPDDR5 SI relateddesign principles
•Strong knowledge in 3D/2D EM simulation tools, electromagnet ticand transmission line theory
•Familiar with power supply architecture covering voltageregulator technologies, PCB and package design trends and trade-offs, andchip supply design including low-power design methodologies
•Familiar with lab equipment including but not limited to VNA,real-time scope, spectrum analyzer
•Ability to work and communicate effectively in amulti-functional team
Education & Experience
•MSEE preferred and relevant experience within technicaldiscipline