SoC Design SpecialistRecruitment site：TaiwanRecord of formal schooling：Bachelor/Master or aboveWork experience：10+ years

Qualifications:

Ÿ 10+ years of SoC design experience in compute-intensive or data-intensive platform with large embedded memories and high-speed IOs, such as chips for high-end smartphone, datacenter, AI training/inference.

References to a particular number of years experience are for indicative purposes only. Applications from candidates with equivalent experience will be considered, provided that the candidate can demonstrate an ability to fulfill the principal duties of the role and possesses the required competencies.

Ÿ   Hands-on capability is necessary

Ÿ   Experience in leading one or more of the following tasks: system/DRAM performance, system thermals, power integrity, DVFS/AVS, design for debug, defining/designing clocking methodologies/schemes, binning; architecture analysis for performance, bandwidth, power, and thermals.

Ÿ   Good understanding of AMBA specifications (CHI/ACE/AXI/AHB/APB), on-chip bus fabric, memory technologies, and DRAM transaction behavior.

Ÿ   Experience in all phases of a modern SoC design flow from specification, pre-Si, post-Si, and commercialization; including entire chip development cycle spanning across architecture, implementation, bring-up experience in validating power/thermal/performance at a system level on boards.

Ÿ   Plus: Experience in leading SoC projects, especially projects with advanced process nodes. ß package, pinmux.

Ÿ   Plus: Experience in optimizations of AI related scenarios.

Ÿ   Plus: Good knowledge of and experience in PCIe.

Ÿ   Plus: Experience in coherency, MMU and concurrency in complex SoC architectures; Experience in CCIX, CXL, Gen-Z, or OpenCAPI.

Ÿ   Plus: Experience in chipset partitioning analysis, PDN analysis, or high-speed interface signal integrity/power integrity analysis and architecture.

Ÿ   Plus: Experience in defining/designing Power distribution strategies, Power regulator requirements, System Power use case analyses.

Ÿ   Plus: Knowledge with packaging and PCB technology.